Most important Features:
Combined PVD & PECVD process - to deposit very smooth coatings
Special Si containing gas line - controlled by additional Mass Flow Controller
- Silicon increases heat resistance
- Silicon decreases internal stress of the coating
- Silicon improves adhesion -> thick DLC coatings are possible
BIAS supply 350 kHz - to enable deposition of non-conductive layers.
Special heaters with dust filter
- grids in front of the heaters
- to avoid contamination of the substrates by dust released from the heaters
VIRTUAL SHUTTER®to clean the target to the back before deposition.
Mechanical TUBE SHUTTERS® to protect targets
- against contamination by acetylene
- against being coated when idle