Most important Features:

Combined PVD & PECVD process - to deposit very smooth coatings

Special Si containing gas line - controlled by additional Mass Flow Controller

  • Silicon increases heat resistance
  • Silicon decreases internal stress of the coating
  • Silicon improves adhesion -> thick DLC coatings are possible

BIAS supply 350 kHz - to enable deposition of non-conductive layers.

Special heaters with dust filter

  • grids in front of the heaters
  • to avoid contamination of the substrates by dust released from the heaters

VIRTUAL SHUTTER®to clean the target to the back before deposition.

Mechanical TUBE SHUTTERS® to protect targets

  • against contamination by acetylene
  • against being coated when idle